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Plasma Cleaning Equipment Product List

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Plasma cleaning device "POEM" (plasma cleaner)

Multi-functional plasma cleaning device. Sample testing currently accepted. Suitable for cleaning and hydrophilization, improving solder wettability, and optimal for pre-treatment before mounting.

Simplifying and reducing the cost of semiconductor manufacturing equipment chambers for application in plasma cleaning. Achieving unprecedented surface treatment through plasma mode switching mechanisms (RIE, DP) and multi-gas (Ar, N2, O2, H2) processes. Substrate cleaning (removal of oxides, organic materials, and fine foreign substances). Hydrophilic treatment (pre-treatment for plating, improving solder wettability). Hydrophobic treatment (pre-treatment before wet processes). Proven results in reflow pre-treatment with significant improvements in solder wettability. Extensive track record in mass production lines for high-end products (high-density mounting substrates, flexible substrates, power device modules). Inline and sheet-type options are available in the standard lineup to match substrate and line configurations.

  • Other mounting machines
  • Plasma Cleaning Equipment

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DLC De-coating Device (Plasma Cleaner for Precision Molds)

A plasma cleaning device with extensive experience in removing DLC films from aspherical lenses. An essential dry film removal device for the repair of high-value-added molds.

Upgraded and customized the highly experienced plasma cleaning device "POEM" for DLC film removal. Improved the energy of ions during processing compared to conventional types, enabling the removal of dense DLC films. Proven results not only in the standard O2 cleaning process but also in the multi-gas process for the removal of various customized DLC films, including Si-containing DLC. Naturally, it also supports the removal of molding residues and oxidation layers on mold surfaces, as well as cleaning before plating. Provides proven processes for cleaning and surface treatment before and after mold specifications.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment
  • Plasma Cleaning Equipment

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Plasma cleaner device "SPE-2136A"

Descum / Surface Modification / Ashing Treatment High-tact model for simultaneous processing of two 6-inch wafers

[General Outline] This equipment can descum, modificate the surface, and ash on φ4 to φ6 inch wafers. In addition, it comes with an automatic transfer mechanism, which contributes to preventing wafer cracking and reducing the work time cost required for wafer transfer. Furthermore, the process room achieves high throughput by processing two wafers at the same time. The equipment body size is W1,400 mm x D2,000 mm, which is a compact design.

  • Plasma surface treatment equipment
  • others
  • Plasma Cleaning Equipment

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